FEP Resin Ds618 Synthetic Electrical and Electronics Insulation Material

Customization: Available
Molecular Principal Chain: Carbon Chain Polymer
Color: Transparency Granuly

Product Description

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Basic Information

Model NO.
DS618
Melting Index
16.2-42.0 G/10min
Appearance
Translucent Particle
Tensile Stress
20 MPa
Fracture Strain
300 %
Relative Gravity
2.12-2.17
Melting Point
265±10 ℃
Dielectric Constant
2.15
Origin
Shandong
HS Code
3904690000
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Product Description

FEP DS618 is a copolymer of TFE and HFP, offering excellent thermal stability, outstanding chemical inertness, superior electrical insulation, and a low coefficient of friction. These properties enable advanced thermoplastic processing methods.

DS618 is a low molecular weight resin with a high melt index, characterized by low extrusion temperatures and high extrusion speeds (5-8 times that of ordinary FEP resin). It is notably soft, anti-burst, and possesses high toughness. This product conforms to Q/0321DYS 003 standards.

FEP Resin DS618

FEP resins are extensively utilized in electrical and electronics, chemical, medical, food processing, and aerospace fields due to their heat resistance, low dielectric properties, and high transparency.

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Specifications

Project Unit DS618 Grades Test Method
A B C D H
Appearance / Translucent particles, no impurities/metal chips. Visible black spots ≤ 2% HG/T 2904
Melt Index g/10min 16.1-20.0 20.1-24.0 ≥ 24.1 12.1-16.0 24-42 GB/T 3682
Tensile Strength Mpa 20.0 18.0 17.5 20.0 21.0 GB/T 1040
Elongation at Break % 300 280 280 300 320 GB/T 1040
Relative Density / 2.12-2.17 GB/T 1033
Melting Point 265±10 GB/T 28724
Dielectric Constant (10⁶ Hz) / ≤ 2.15 2.07 GB/T 1409
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Product Gallery

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Applications & Usage

Main Applications

Primarily used in the aviation and aerospace industry, MTR transport vehicles, automatic switching equipment, well test equipment, flame alarm systems, and high-rise buildings. It is particularly suitable for high-speed extrusion of small-caliber wire insulation materials and is economical for applications not requiring high stress cracking resistance.

Important Attention

Processing temperature should not exceed 420°C to prevent the release of toxic gases.

Package & Storage

1. Packed in plastic bags of 25kg net each.
2. Store in clean, cool, and dry places; avoid contamination from dust and moisture.
3. The product is non-toxic, non-inflammable, and non-explosive. Transport as a non-dangerous product.

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Frequently Asked Questions

Q1: What is the primary advantage of DS618 compared to ordinary FEP resin?
DS618 has a lower molecular weight and higher melt index, allowing for extrusion speeds 5-8 times faster than ordinary FEP resins.
Q2: What is the melting point of FEP DS618?
The melting point for FEP DS618 is 265±10 ℃.
Q3: Is there a temperature limit for processing?
Yes, processing temperatures should be kept below 420°C to avoid the release of toxic gases.
Q4: What are the typical applications for this material?
It is widely used for high-speed extrusion of small-caliber wire insulation in aerospace, communication networks, and fire alarm systems.
Q5: How is the product packaged for transport?
The standard packaging is 25kg net per plastic bag, and it is transported as a non-dangerous product.
Q6: What is the appearance of the resin?
The material appears as translucent particles, strictly controlled to have minimal visible black spots or impurities.

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