Cu/Mo/Cu (CMC) Heat Sink Electronic Packing Sandwish Composite Heat Sink Materials

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Cu/Mo/Cu (CMC) Heat Sink Electronic Packing Sandwish Composite Heat Sink Materials

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Product Description

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Basic Specifications

Model NO.

Customized

Application

Many Aspects

Machining

CNC Machining

Material

Cu/Mo/Cu

Surface Preparation

Customize

Certification

ISO 9001:2015

CMC13/74/13 Density

9.88 g/cm3

Production Capacity

10000 Pieces/Month

HS Code

854290000

Transport Package

Vacuum Packing

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Cu/Mo/Cu (CMC) Heat Sink Overview

Cu/Mo/Cu (CMC) heat sink, also known as CMC alloy, is a sandwich-structured and flat-panel composite material. It uses pure molybdenum as the core material and is covered with pure copper or dispersion-strengthened copper on both sides. This structure provides an adjustable coefficient of thermal expansion, high thermal conductivity, and high thermal stability.

S-CMC is a multi-layered Copper and Molybdenum clad metal, offering excellent properties including low CTE and high thermal conductivity. Its superior thermal performance compared to similar materials makes it ideal for high-powered electronic packages.

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Product Properties

Grade	Density (g/cm3)	CTE ×10-6 (20ºC)	Thermal Conductivity W/(M·K)
CMC111	9.32	8.8	305(XY)/250(Z)
CMC121	9.54	7.8	260(XY)/210(Z)
CMC131	9.66	6.8	244(XY)/190(Z)
CMC141	9.75	6	220(XY)/180(Z)
CMC13/74/13	9.88	5.6	200(XY)/170(Z)

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S-CMC Material Specifications

Material	Mo Content (Wt%)	Density (g/cm3)	Thermal Conductivity (25ºC)	CTE (25ºC)
S-CMC	5	9.0	362	14.8
	10	9.0	335	11.8
	13.3	9.1	320	10.9
	20	9.2	291	7.4

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Applications

Thermal Management: Thermal mounting plates and chip carriers for microwave applications.
RF & Laser: Flanges and frames for RF, laser diode packages, and GaAs device mounts.
Optoelectronics: LED packages, BGA packages, and wireless communication packaging.

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Product Show

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Frequently Asked Questions

What is a Cu/Mo/Cu (CMC) heat sink?

It is a sandwich-structured composite material featuring a molybdenum core layered between pure copper, designed for high-performance thermal management.

What are the main advantages of using CMC materials?

CMC offers an adjustable coefficient of thermal expansion (CTE), high thermal conductivity, and excellent thermal stability, making it superior for power-dense electronics.

In which industries are these heat sinks used?

They are widely used in wireless communication, optoelectronics, RF technology, laser diode packaging, and LED manufacturing.

Can the dimensions and properties be customized?

Yes, both standard CMC and S-CMC materials can be customized in terms of grade, dimensions, and surface preparation to meet specific application requirements.

What is the difference between CMC and S-CMC?

S-CMC is a multi-layered variant specifically designed for higher thermal conductivity in the XY plane, contributing to more efficient heat dissipation in electronic packages.

What certifications do these products hold?

The manufacturing processes comply with ISO 9001:2015 standards, ensuring consistent quality and reliability.